7th Bondexpo – International trade fair for bonding technology

Date: 7th-10th October 2013


With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Venue: Stuttgart

Website: http://www.bondexpo-messe.de/en/bondexpo/